• High complexity: Developing novel high-density photonic packaging concepts that simultaneously address thermal management, optical alignment, RF signal integrity, and manufacturability – an area with few industry precedents
• Strategic freedom: Broad autonomy to define requirements, select suppliers, and design technical strategies within strategic goals and budgetary limits
• Decision authority: Direct influence on supplier relationships, product architecture decisions, and program economics
  innovation mandate: Implementation of at least one new packaging material, process, or architecture annually that becomes differentiating IP for the company
• Real-world impact: Your work directly enables technology already deployed in production at world-leading institutions like the Leibniz Supercomputing Centre

Within your first 18-24 months, you will:

• Achieve leading-edge integration density and performance through innovative packaging architectures that enable our photonic processors to deliver up to 30x energy efficiency vs. conventional systems
• Minimize integration risks and rework through rigorous supplier verification and quality assurance
• Contribute to competitive advantage by accelerating time-to-market and optimizing cost-performance trade-offs in the rapidly scaling photonic computing market
  

Key responsibilities:

• Cross-functional leadership: Coordinate internal R&D, system engineering, manufacturing, and test teams to align packaging solutions with overall product architecture
• Supplier engagement & interface role: Act as the primary point of contact for suppliers, ensuring alignment on technical goals, schedules, and deliverables, including contract management and negotiation
• Project control: Plan and oversee multi-party R&D projects, tracking milestones, budgets, and risks, while ensuring deliverables are verified and integrated into final systems
• Technical specification: Define complete packaging requirements, including optical coupling techniques, thermal management strategies, RF signal integrity, and hermetic sealing methods
• Quality assurance: Ensure supplier quality ratings maintain ≥95% on-time delivery with zero critical defects, and packaging costs remain within ±5% of budgeted targets

• More than 5 years of experience in hybrid packaging, photonics assembly, optoelectronic integration, or related high-density interconnect technologies
• Proven track record in managing supplier-led R&D and packaging projects, from requirements definition through to integration and validation
• Hands-on experience with PICs, laser sources, photodetectors, analog electronics, and mixed-signal integration
• Master's or PhD in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field

• Optical coupling techniques (butt-coupling, lens coupling, fiber array integration)
• Thermal management strategies for high-power photonic devices
• Understanding and enhancement of RF signal integrity for highest performance in different high density interconnects
• Packaging material science (polymers, ceramics, metals) and hermetic sealing methods
• Relevant standards for reliability and environmental testing (e.g., Telcordia, JEDEC)

• Familiarity with CAD tools for photonics/electronics packaging, optical simulation software, and statistical process control
  

• Exceptional ability to lead cross-functional teams across R&D, system engineering, manufacturing, and test domains
• Skilled in negotiation and contract management with external suppliers and R&D partners
• Strong systems thinking to balance optical, electrical, thermal, and mechanical requirements simultaneously
• Excellent communication skills with the ability to translate complex technical trade-offs to management and stakeholders

• Fluent in English; German or other European language beneficial

• Experience with photonic integrated circuit (PIC) packaging for AI or HPC applications
• Knowledge of high-speed digital interfaces and their integration with photonic systems
• Familiarity with scaling systems from prototype to volume production
• Understanding of supply chain management and material supplier ecosystems in photonics

• Make impact at scale: Help solve one of computing's biggest challenges—making growing demand in compute and sustainability go hand in hand
• Work on the leading edge: Photonic AI acceleration technologies that will define the next decade of computing - already validated in production HPC environments
• Own your work from day one: Broad autonomy and decision authority with direct impact on product success and the future of AI infrastructure
• Fast-track your growth: Work on challenges with few industry precedents—every problem you solve becomes new institutional knowledge and potentially industry-defining IP
• World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, processor design, and AI systems
• Direct access to leadership: Work closely with the company's founders, including CEO Dr. Michael Förtsch, and advisory board members who shaped the semiconductor industry (ARM, Intel, Infineon)
• Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving
• Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream—your contributions will shape this transformation

Why Q.ANT

• Work on photonic AI acceleration technologies already deployed in a production HPC environment
• Help solve one of computing’s biggest challenges: scaling AI compute while keeping power and sustainability in balance
• High autonomy and decision authority – your architecture decisions directly shape how photonic processors operate and become company IP
• Deep-tech scale-up with strong funding and an international team combining photonics, processor and AI systems expertise